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IX4R11
Absolute Maximum Ratings
Symbol
V CH
V HS
V HGO
V CL
V LGO
V DD
V DG
V IN
dV S /dt
P D
P D
R THJA
R THJc
Definition
High side floating supply voltage
High side floating supply offset voltage
High side floating output voltage
Low side fixed supply voltage
Low side output voltage
Logic supply voltage
Logic supply offset voltage
Logic input voltage(HIN & LIN)
Allowable offset supply voltage transient
Package power dissipation@ T A ≤ 25C
Package power dissipation@ T C ≤ 25C
Thermal resistance, junction-to-ambient
Thermal resistance, junction-to-case
Min
-25
V CH -200
V HS -.3
-0.3
-0.3
-0.3
V LS -3.8
V SS -.3
Max
650
V CH +.3
V CH +.3
35
V CL +.3
V DG +35
V LS +3.8
V DD +.3
50
1.25
2.5
100
50
Units
V
V
V
V
V
V
V
V
V/ns
W
W
K/W
K/W
T J
Junction Temperature
150
o
C
T S
T L
Storage temperature
Lead temperature (soldering, 10 s)
-55
150
300
o
o
C
C
Recommended Operating Conditions
Symbol
Definition
Min
Max
Units
V CH
High side floating supply absolute voltage V HS +10
V HS +20
V
V HS
V HGO
V CL
V LGO
V DD
V DG
V IN
High side floating supply offset voltage
High side floating output voltage
Low side fixed supply voltage
Low side output voltage
Logic supply voltage
Logic supply voffset voltage
Logic input voltage(HIN, LIN, ENbar)
-20
V HS
10
0
V DG +3
V LS -1
V DG
650
V CH +20
20
V CC
V DG +20
V LS +1
V DD
V
V
V
V
V
V
V
T A
Ambient Temperature
-40
125
o
C
Ordering Information
Part Number
IX4R11P7
IX4R11S3
Package Type
14-PIN DIP
16-PIN SOIC
3
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